Last week, Honor teased the upcoming Honor 70 series will be launched on May 30 in the Chinese market. The company is rumored to debut three smartphones in this series dubbed Honor 70, Honor 70+, and Honor 70 Pro+.
Now, ahead of the launch, the alleged Honor 70 Pro has been spotted on Geekbench with model number SDY-AN00. Last week, the same device was also spotted on the 3C certification website.
According to the Geekbench listing, the smartphone has an ARMv8-based octa-core chipset. Four of the cores are clocked at 2.75GHz and the remaining four have a clock speed of 2.00GHz. The listing also reveals that the chipset brings along the Mali-G610 MC6 GPU, making it highly likely that this chipset is the MediaTek Dimensity 8000 SoC.
Other than that, the listing reveals that the device has 12GB of RAM and runs on the Android 12-based operating system, likely the Magic UI 6.0. The smartphone scored 819 points on the single-core test and 3303 points on the multi-core test of Geekbench 5.
Other than that, the design of the upcoming smartphone has already leaked via renders showing a triple camera setup on two large circular-shaped camera islands. It is rumored to house a 54-megapixel (Sony IMX800) primary sensor clubbed together with a 50-megapixel ultrawide lens and an 8-megapixel telephoto camera.
Other than that, the device is expected to come with an FHD+ OLED LTPO panel with a 120W refresh rate and will likely come with a 4,600mAh battery and 100W fast charging.
