Mediatek teased a Dimensity 8000 platform back in December, and reports were it is going to be manufactured on the 5nm process by TSMC. The chip is almost ready to launch. it will be named Dimensity 8100 when it arrives in March.
The novelty is credited with eight cores with four productive Cortex-A78 at 2.75 GHz. In addition, the chip should receive a built-in 5G modem and Mali-G510 graphics. The performance of the SoC is said to be better than the Snapdragon 870. Platform is likely to arrive as a successor of the Dimensity 1100 because it will be a step down from the Dimensity 9000, Mediatek’s true flagship platform.
According to rumors, They are expected to be released by Redmi and Realme. It is reported that Dimensity 8100 will form the basis of one of the Redmi K50 series smartphones. The Chinese found a two-section battery, a lot of thermal paste around the motherboard with a Qualcomm Snapdragon 8 Gen1 processor, and a large evaporation chamber. The latter was reached only after removing the screen.
